For this 16th edition, the Congress treats topics related to embedded systems, power electronics and the management of energy systems : AC/DC energy converters, batteries, hydrogen technologies, lithium-ion, electromagnetic compatibility, SIC components, thermal management, etc.
09:20 - 09:50
LightBattery Pack for high power applications
Electric and hybrid propulsion systems require a battery pack with very high performance, especially in terms of power density. In the Clean Sky 2 LiBAT project (funded by the European Union), a consortium formed by the companies TWT Gmbh and Lion Smart Gmbh, supported by the Universities of London City and Liverpool John Moores, has developed and tested an ambitious battery pack prototype integrating thermal management and power conversion functions. For this, innovative multi-level inverter technology is used to convert electrical power while minimizing hardware. The presentation describes the developed technology, and emphasizes the contribution of simulation throughout development.
10:30 - 11:00
SiCRET : Silicon Carbide Reliability Evaluation for Transport
The project deals with the
maturity assessment of Silicon Carbide (SiC) power semiconductor technology by:
i) taking in consideration the most advanced commercial and quasi-commercial
solutions, ii) tackling the most limiting drawbacks by systematically investigating
the underlying physics of failure for given usage profile; iii) establishing
guidelines to define adequate qualification test strategy depending on
application use profile ; iiii) definition of qualification test strategy and
establishment of mitigation solution such as design guidelines/recommendations
(SOA / Robustness / Derating rules for Safety Margins).
Enable end-user to overcome the barriers to adoption and accelerate time-to-markets.
11:05 - 11:35
Novel encapsulation resin with high thermal conductivity for the protection of power module in harsh environment : PROTAVIC PTS 80001
This workshop will present a single-component liquid electrical insulating resin with very high thermal conductivity (> 4.2 w / mK) and polymerization at room temperature, meeting the specifications of the electronics industry, in particular for encapsulation of power electronic components when they are subjected to harsh environments requiring very high heat dissipation such as power converters or battery chargers based on SiC and GaN technologies.
11:40 - 12:10
Electrification of embedded systems: Passive components in front of electrical and thermal requirements
In embedded systems, research of electrical performances is associated to weight and volume reduction. The result is important thermal and electrical constraints. Associating technical skills of its different activities (bus bars, thermal management, capacitors, …), Mersen offers to answer to these challenges. First, developing laminated bus bars with optimized designs (very low inductance) and working on integration in power systems. But also improving thermal management, thanks to more thermal resistant components (bus bars up to 180°C) or with high-efficiency cooling solutions.